
Molybdenum Target
2. Catalog: Molybdenum product
3. Material: Pure molybdenum, Molybdenum alloy
4. Purity: 3N5, Mo≥99.95%
5. Density: 10.2g/cm3
6. Shape: Disc, Round, Square, Tube, Plate, Bar, Strip
7. Type: Rotary targets, Planar targets, Round target, Plate target, Flat target, Customized target with irregular shape
8. Surface: Polished, Bright metallic luster, Smooth
9. Application: Mainly used for sputtering coating process in physical vapor deposition (PVD) technology. And CVD, APS, VPS coating technology.
10. Manufacturing technique: Sintering, Forging, Rolling, Annealing, Heat treatment, Machining.
Molybdenum target, also known as molybdenum sputtering target, is a metal target made of high-purity molybdenum or molybdenum alloy. It is a thin film deposition material and is one of the main materials used to make thin films. It is mainly used in the sputtering coating process in physical vapor deposition (PVD) technology. It is also suitable for all flat coating and rotary coating systems.
Sputtering is a physical vapor deposition method. Mo targets can be classified into different types, including square targets, round targets, plate targets, rotating targets and customized targets. We can provide molybdenum sputtering targets of various sizes with a purity of up to 99.95%.
Molybdenum has a high melting point, high conductivity, low specific impedance, good corrosion resistance and good environmental performance, so that molybdenum sputtering target can form a molybdenum coating on various substrates through magnetron sputtering process. This molybdenum coating is widely used in electronic components and electronic products.
Luoyang Rare Metal Research Material Co.,Ltd specializes in producing various kinds of Mo targets, including planar targets and rotary targets, covering molybdenum sputtering targets and molybdenum anode targets to match different types of magnetron sputtering equipment. All products will be customized according to your requirements.
The targets we produce have high purity, low impurity content, high density, fine and evenly distributed grain size, and the smallest average grain size, with excellent performance. At the same time, we can carry out mass production in a short time, and the delivery time is guaranteed.
Product Specification
Molybdenum Target Type:
- Square and Round Mo Target
It can form films on various types of substrates, and these films can be used in the electronic components.
- Plate Mo Target
The single plate can be used for the TFT sputtering and the coating equipment. Various dimensions are available on request, and it can be supplied in large sizes with the back plates.
- Rotary Mo Target
It will be rotated at a slow speed with the stationary magnets during the operation. The efficiency is much higher than the Molybdenum Plate Target. The dimension is O.D 10'' max., W.T .12''-1'' and Length 120'' max.
- Customized Mo target
Available on request.
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Molybdenum Target Specification |
||||
|
Processing Range |
Thickness/Diameter(mm) |
Width(mm) |
Length(mm) |
Roughness(mm) |
|
G4.5~11.5 Target |
1.5~40 |
1.0~2500.00 |
1.0~4000.00 |
Ra0.2~6.4 |
|
Molybdenum Tube Target |
120~170 |
/ |
3500 |
Ra0.2~6.4 |
Product performance features
1) High Purity:
The purity of Mo target is a key indicator of its performance. Generally speaking, the purity our Mo target can reach 99.95% or even higher. High purity ensures the minimization of impurities during the film deposition process, thereby improving the quality of the final product.
2) High Density:
Density close to the theoretical density of molybdenum (10.22 g/cm³) is a sign of high-quality moly target. Higher density indicates that there are fewer voids in the material and the structure is compact, which is crucial to improving the service life and stability of the target material.
3) High Thermal Conductivity:
The thermal conductivity of molybdenum is about 138 W/m·K. High thermal conductivity is very important for temperature control of the target during high-speed coating, which helps prevent overheating and structural damage of the target.
4) Low Coefficient of Thermal Expansion:
Molybdenum has a low coefficient of thermal expansion of about 4.8×10^-6 /°C. This feature means that the product has good dimensional stability under temperature changes, which helps to maintain the consistency and accuracy of the film deposition process.
5) High Hardness and Strength:
Molybdenum has a Vickers hardness of about 2500 HV and has high mechanical strength. This enables the product to withstand the mechanical impact during high-speed coating.
6) Good Surface Flatness and Roughness:
Surface flatness and roughness are also important parameters for evaluating the quality of mo targets. Good surface treatment can reduce the generation of particles during the use of the target and improve the uniformity and quality of the deposited film.
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Molybdenum Target Properties |
|
|
Chemical symbol |
Mo |
|
Atomic number |
42 |
|
Atomic weight |
95.96 g/mol |
|
Crystal structure |
Az Body-centered cubic (BCC) |
|
Purity |
99.95% min |
|
Density /g·cm-3 |
10.2 g/cc |
|
Melting point |
2617.0 °C (2890.15 K, 4742.6 °F) |
|
Boiling point |
4612.0 °C (4885.15 K, 8333.6 °F) |
|
Thermal conductivity |
138 W/m x K |
|
Coefficient of thermal expansion/K-1 |
(0-1600℃): 4.8×10^-6/℃ |
|
Vickers Hardness |
2500 HV |
|
Color/Appearance |
Silver white, Metallic |
|
Z Ratio |
0.257 |
|
Sputter |
DC |
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Max Power Density (Watts/Square Inch) |
150 |
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Type of Bond |
Indium, Elastomer |
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Specific heat |
0.276 kJ/kg x K at 20°C |
|
Specific latent heat of fusion |
270 kJ/kg (Estimate value) |
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Heat of combustion |
7.58 MJ/kg |
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Electrical resistivity: |
53.4 nΩ·m at 20°C |
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Electrical conductivity |
34% IACS at 0°C |
|
Yield strength |
(1600℃): 50MPa |
|
Low vapor pressure |
(2151℃): 4.48X10⁻⁷Pa |
Product chemical Composition
Molybdenum Sputtering Target Material Chemical Composition
| Material | Mo | Impurities, (≤%) | |||||||||
| Al | Ca | Fe | Mg | Ni | Si | C | N | O | La2O3 | ||
| Mo1 | Bal. | 0.002 | 0.002 | 0.010 | 0.002 | 0.005 | 0.01 | 0.01 | 0.003 | 0.008 | – |
| Mo2 | Bal. | 0.005 | 0.004 | 0.015 | 0.005 | 0.005 | 0.01 | 0.02 | 0.003 | 0.020 | – |
| MoLa | Bal. | 0.002 | 0.002 | 0.015 | 0.005 | 0.005 | 0.01 | 0.02 | 0.005 | – | 0.1~1.8 |
| Note: The O content of MoLa alloy can be tested according to customer requirements. | |||||||||||
Product Application
Molybdenum target material can form a thin film on the substrate. It is widely used in:
- Semiconductor manufacturing, electronic components and microelectronics industry, integrated circuits, information storage, laser storage, electronic control devices.
- Conductive glass, optical glass, coated glass industry (mainly including architectural glass, automotive glass, optical film glass, etc.)
- Ion plating and other industries.
- Thin-film solar photovoltaic cells.
- Medical imaging equipment.
- Flat panel displays, liquid crystal displays, touch screens.
- Automotive lights, decorative coatings and tool and mold coatings, etc.
- It can also be used in wear-resistant materials, high-temperature corrosion materials etc.

Why Choose Us?
1) High purity
We choose high-purity molybdenum powder as raw material; the purity is above 99.95%, and the introduction of impurity elements is strictly controlled during the preparation process. It ensures that the sputtered film has good performance.
2) High density
We choose the forming and sintering technology that can achieve rapid densification, and the relative density of the sputtering target is above 98%. , To ensure the low porosity of the target, the target with higher density can reduce the splash of film particles during the coating process, thereby improving the quality of the film.
3) Small and uniform grain size
The molybdenum target we produce has a more uniform microstructure distribution, can form a specific crystal orientation, and the grains are small and uniform. The sputtering rate of the target material with fine grains is faster than that of the coarse grains, and the target material with a smaller difference in grain size has a more uniform thickness distribution of the deposited film. The sputtering performance of the mo target is better.
4) A wide range of target materials to choose from
There are many types of molybdenum sputtering targets that we can provide you with. According to the shape, they can be divided into molybdenum round targets, square targets, bar targets and tube targets. According to the material classification, they can be divided into pure moly targets and moly alloy targets.
5) A full set of production equipment
Luoyang Rare Metal Research Material Co.,Ltd has a full set of equipment such as large isostatic pressing, large vacuum and gas protection sintering furnaces, large CNC milling machines and large CNC grinders, as well as mature production processes, which can mass produce various types of products.
6) Complete testing equipment
We are able to provide a complete set of physical property testing equipment, such as density, hardness, surface roughness, etc. Therefore, when using eddy current testers and ultrasonic equipment, possible internal damage of the product, such as pores and cracks, can be strictly checked to ensure the high quality of the product.
|
Item |
Power Density(W/cm2) |
Substrate Temperature(℃) |
Film formation Rate(A·m/min) |
Specific Resistivity@2000A(μΩcm) |
|
Mo Target |
5.0 |
100.0 |
342.8 |
11.7 |
Product Production Process
Molybdenum targets are produced by powder metallurgy.
First, Molybdenum powder is screened and loaded into the mold for pressing.
After pressing and forming, it is sintered in a medium frequency induction furnace or a vacuum sintering furnace, and then rolled and machined. Finally, it is processed into a finished target material that meets the size and surface requirements of the customer.
Powder metallurgy makes the products have high density, good uniformity and excellent performance in microstructure, and it also has the characteristics of short production cycle, few processes, low energy consumption and small material loss.

The use principle of molybdenum target
Molybdenum target is mainly used for magnetron sputtering coating, which is a new physical vapor deposition (PVD) method. An orthogonal magnetic field and electric field are added between the sputtered target (cathode) and the anode, and the required inert gas (usually Ar gas) is filled in the high vacuum chamber. Under the action of the electric field, the Ar gas is ionized into positive ions and electrons. A certain negative high voltage is applied to the target. The electrons emitted from the target are affected by the magnetic field and the ionization probability of the working gas increases, forming a high-density plasma near the cathode. The Ar ions are accelerated to fly to the target surface under the action of the Lorentz force, bombarding the target surface at a very high speed, so that the atoms sputtered on the target follow the momentum conversion principle and fly to the substrate with higher kinetic energy to form a film.
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