Molybdenum Sputtering Target
2.Catalog: Molybdenum product
3.Material: Pure molybdenum
4.Purity: Mo≥99.95%
5.Density: 10.22 g/cm3
6.Shape: Round, Square, Tube, Plate, Bar, Rectangle
7.Type: Planar targets, Rotating target, Round target, Plate target, Flat target, customized target with irregular shape.
8.Manufacturing Technique: Powder metallurgy process, Sinterted, Forging, Rolling, Machining.
9.Application: Vacuum sputtering coating, Flat panel displays, CIGS solar cell electrodes and wiring materials, Semiconductor barrier layer materials.
10.Place of Origin: Luoyang, China
Introduction
Molybdenum Sputtering Target is a metal target material mainly composed of high-purity molybdenum (Mo) and used in vacuum coating technologies such as magnetron sputtering. It will "sputter" out surface atoms under the bombardment of high-energy particles and deposit on the substrate to form a thin film.
Advantages
1. Excellent high purity and density
Molybdenum sputtering targets are made of high-purity molybdenum materials (Mo≥99.95%). The raw materials are strictly screened and impurity controlled to ensure that the release process of molybdenum atoms during vacuum sputtering does not carry impurity atoms, thereby effectively ensuring the purity and functional performance of the deposited film. In addition, the target density can reach 10.22 g/cm³, which is close to the theoretical density of molybdenum. High density not only helps to improve sputtering efficiency and film formation rate, but also prolongs the service life of the target and reduces the incidence of quality problems such as slag and cracks.
2. Advanced manufacturing process
Molybdenum targets use powder metallurgy forming technology in the manufacturing process, combined with multiple steps such as hot forging, rolling and precision machining to ensure the uniformity and stability of the organizational structure. These process methods can effectively control the grain size and mechanical properties of the material, thereby improving the structural integrity and thermal shock resistance of the target during long-term use.
3. Wide application adaptability
First, in vacuum sputtering coating technology, molybdenum targets are often used for the deposition of metal films. They can adapt to a variety of magnetron sputtering systems and process requirements to meet the functional requirements of different coatings. Secondly, in flat panel display technology, molybdenum materials are widely used in the preparation of back electrode layers such as OLED and TFT-LCD, with stable film-forming performance and electrical performance. Molybdenum targets are also suitable for the electrode layer of CIGS thin-film solar cells, especially in their back electrode structure. The high conductivity of the molybdenum layer helps to improve the energy conversion efficiency.
Product Specification
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Molybdenum Sputtering Target Specification |
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Product Type |
Thickness/Diameter(mm) |
Width(mm) |
Length(mm) |
Roughness(mm) |
Application |
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Molybdenum planar target |
1.5~40 |
1.0~2500.00 |
1.0~4000.00 |
Ra0.2~6.4 |
Suitable for G3~G10.5 generation TFT coating equipment |
|
Molybdenum rotating target |
120~170 |
/ |
3500 |
Ra0.2~6.4 |
|
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Test Results Of Molybdenum Target Used in Sputtering Deposition |
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Product |
Target power density(W/cm2) |
Substrate temperature (℃) |
Film formation rate(A·m/min) |
Specific resistivity@2000A(μΩcm) |
|
Mo Target |
5.0 |
100.0 |
342.8 |
11.7 |
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